Replisaurus Technologies, Inc

Replisaurus has developed a revolutionary metallization technology targeted at key growth markets such as integrated passives, copper pillars and 3D integration (TSV). The ElectroChemical Pattern Replication (ECPR™) process offers a simple and cost effective integrated solution eliminating several traditional process steps thereby reducing complexity. ECPR is a fabfriendly, environmentally clean process which does not use any solvents, developers or strippers and has extremely fast plating rates. The ECPR technology is a “Design Enabling” technology for integrated passives enabling advanced designs, liminating the need for prototyping and dummy plating patterns. The electrochemical replication principle of ECPR combines the precision and resolution of advanced lithography with the ease and efficiency of electrochemical deposition into one single integrated process solution.